Kulicke and Soffa Industries, Inc. expands upon its core semiconductor assembly business through four primary segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company's capital equipment is utilized by semiconductor device manufacturers and outsourced semiconductor assembly and test (OSAT) providers to package and assemble chips. Beyond upfront machinery sales, Kulicke and Soffa generates recurring revenue through its APS segment, which supplies expendable tools, spare parts, equipment upgrades, and maintenance services. The company maintains a significant global footprint with manufacturing facilities, research and development centers, and sales offices across Asia, Europe, and the Americas, allowing it to closely support regional foundries and global supply chains.
