ChipMOS Technologies Inc. operates primarily through segments including Testing, Assembly, LCD and other Display Panel Driver Semiconductor Assembly and Testing, and Bumping. The company provides a comprehensive range of services, from engineering testing and wafer probing to final testing and packaging using leadframe-based and organic substrate-based technologies. Its semiconductor solutions are utilized across diverse end markets, such as consumer electronics, personal computers, communications equipment, and automotive applications. Headquartered in Hsinchu, Taiwan, ChipMOS maintains advanced facilities in the Hsinchu Science Park, Hsinchu Industrial Park, and Southern Taiwan Science Park. The current legal entity listed on the Taiwan Stock Exchange in 2014 and later absorbed its Bermuda-based parent company in 2016 to assume its NASDAQ listing.
