BE Semiconductor Industries N.V. (Besi) operates primarily through three business segments: Die Attach, Packaging, and Plating. The Die Attach segment is the company's largest revenue driver, offering single-chip, multi-chip, flip-chip, and thermo-compression bonding systems. Besi's packaging equipment includes wafer-level molding and singulation systems, while its plating equipment provides metal plating systems for solar cells and electronic connectors. Headquartered in Duiven, the Netherlands, the company maintains a global footprint with production facilities in China and Malaysia, and significant revenue generated from customers in Asia. Besi serves major semiconductor manufacturers, foundries, and outsourced assembly and test (OSAT) companies, holding a leading market share in advanced die attach equipment.
