Founded in 1968, Amkor Technology pioneered the outsourced semiconductor assembly and test (OSAT) model and has grown into one of the world's largest providers in the industry. The company's comprehensive portfolio includes advanced packaging solutions such as flip-chip, wafer-level packaging, and system-in-package (SiP) modules, which are critical for smartphones, automotive systems, data centers, and IoT devices. Amkor provides end-to-end turnkey services, from initial package design and wafer bumping to final system-level testing and drop shipment. With a massive global footprint, the company operates production facilities, product development centers, and sales offices across key electronics manufacturing regions in countries like South Korea, Japan, China, Taiwan, the Philippines, Malaysia, Portugal, and the US. By partnering with leading foundries and electronics OEMs, Amkor enables the high-volume manufacturing of complex, next-generation semiconductor technologies.
