ACM Research, Inc. develops, manufactures, and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, and thermal processes. Headquartered in California with primary operations in mainland China, the company focuses on improving product yield for advanced semiconductor devices and wafer-level packaging. Its proprietary technologies, such as Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO), are designed to remove random defects without damaging delicate wafer features. The company's product portfolio includes wet cleaning equipment for front-end production, electrochemical plating tools, and advanced packaging equipment like coaters, developers, and photoresist strippers. While incorporated in the United States, ACM Research conducts the vast majority of its manufacturing, research and development, and sales through its subsidiary ACM Research (Shanghai), Inc. The company targets specific process steps in semiconductor fabrication, positioning itself as a specialized equipment provider for foundry, logic, and memory chip makers across Asia, North America, and Europe.
